Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Rabindra N. Das, John M. Lauffer, Roy H. Magnuson, Konstantinos I. Papathomas, Benson Chan | 2016-09-20 |
| 9351408 | Coreless layer buildup structure with LGA and joining layer | Timothy Antesberger, Frank D. Egitto, William E. Wilson, Rabindra N. Das | 2016-05-24 |