Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Rabindra N. Das, Voya R. Markovich, John M. Lauffer, Roy H. Magnuson, Benson Chan | 2016-09-20 |