Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437512 | Integrated circuit package structure | Tzu-Hung Lin | 2016-09-06 |
| 9437534 | Enhanced flip chip structure using copper column interconnect | Tzu-Hung Lin, Che-Ya Chou | 2016-09-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437512 | Integrated circuit package structure | Tzu-Hung Lin | 2016-09-06 |
| 9437534 | Enhanced flip chip structure using copper column interconnect | Tzu-Hung Lin, Che-Ya Chou | 2016-09-06 |