Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406641 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2016-08-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406641 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Kuo-Chun Huang | 2016-08-02 |