Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496216 | Semiconductor package including stacked semiconductor chips and a redistribution layer | Sung-Hoon Chun, Hye Jin Kim, Sang-Ho An, Kyung-Man Kim | 2016-11-15 |
SL
Seok-Chan Lee
Overall (2016): #234,277 of 481,213Top 50%
1
Patents 2016