Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496216 | Semiconductor package including stacked semiconductor chips and a redistribution layer | Sung-Hoon Chun, Hye Jin Kim, Kyung-Man Kim, Seok-Chan Lee | 2016-11-15 |
| 9379062 | Semiconductor package | Ki-Hong Jeong, Sang-Sub Song | 2016-06-28 |