Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Voya R. Markovich, John M. Lauffer, Roy H. Magnuson, Konstantinos I. Papathomas, Benson Chan | 2016-09-20 |
| 9420689 | Method of making a circuitized substrate | Michael Rowlands | 2016-08-16 |
| 9351408 | Coreless layer buildup structure with LGA and joining layer | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, William E. Wilson | 2016-05-24 |