Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Tzu-Chieh Shen +1 more | 2016-11-29 |
| 9490225 | Package structure and fabrication method thereof | Wei-Chung Hsiao, Chun-Hsien Lin, Yu-Cheng Pai, Shih-Chao Chiu | 2016-11-08 |