Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2016-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9510463 | Coreless packaging substrate and fabrication method thereof | Yu-Cheng Pai, Chun-Hsien Lin, Shih-Chao Chiu, Wei-Chung Hsiao, Ming-Chen Sun +1 more | 2016-11-29 |