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Multiheight electrically conductive via contacts for a multilevel interconnect structure |
Keisuke Izumi, Hiroshi Sasaki |
2016-12-20 |
| 9437543 |
Composite contact via structure containing an upper portion which fills a cavity within a lower portion |
Akira Nakada, Motoki KAWASAKI, Sung-Tae Lee |
2016-09-06 |
| 9412753 |
Multiheight electrically conductive via contacts for a multilevel interconnect structure |
Keisuke Izumi, Hiroshi Sasaki |
2016-08-09 |
| 9401309 |
Multiheight contact via structures for a multilevel interconnect structure |
Keisuke Izumi, Naohito Yanagida, Takehiro Yamazaki, Hiroaki Iuchi, Akio Yanai +2 more |
2016-07-26 |
| 9368601 |
Method for forming oxide below control gate in vertical channel thin film transistor |
Kensuke Yamaguchi, Akira Nakada, Naohito Yanagida |
2016-06-14 |
| 9305937 |
Bottom recess process for an outer blocking dielectric layer inside a memory opening |
Masanori Tsutsumi, Hiroshi Sasaki, Hiroyuki Ogawa, Masato Miyamoto, Kensuke Yamaguchi +1 more |
2016-04-05 |
| 9230905 |
Trench multilevel contact to a 3D memory array and method of making thereof |
Seje Takaki, Zhen Chen |
2016-01-05 |