Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401309 | Multiheight contact via structures for a multilevel interconnect structure | Keisuke Izumi, Naohito Yanagida, Michiaki Sano, Takehiro Yamazaki, Hiroaki Iuchi +2 more | 2016-07-26 |
| 9236392 | Multiheight electrically conductive via contacts for a multilevel interconnect structure | Keisuke Izumi, Hiroaki Iuchi, Ryo Taura, Kentaro Sera | 2016-01-12 |