Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437516 | Chip-embedded packages with backside die connection | Ralf Otremba, Josef Höglauer, Johannes Lodermeyer, Thorsten Scharf | 2016-09-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437516 | Chip-embedded packages with backside die connection | Ralf Otremba, Josef Höglauer, Johannes Lodermeyer, Thorsten Scharf | 2016-09-06 |