TS

Thorsten Scharf

IA Infineon Technologies Austria Ag: 2 patents #49 of 239Top 25%
US Usines Claas France S.A.S: 2 patents #1 of 4Top 25%
📍 Regensburg, DE: #23 of 285 inventorsTop 9%
Overall (2016): #33,491 of 481,213Top 7%
4
Patents 2016

Issued Patents 2016

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
9437516 Chip-embedded packages with backside die connection Ralf Otremba, Josef Höglauer, Manfred Schindler, Johannes Lodermeyer 2016-09-06
9357709 Combination of a towing vehicle and an agricultural harvesting machine drawn thereby including a control device for specifying a ground speed of the combination Julien Waechter, Frédéric Chesnier 2016-06-07
9288945 Baler Ulrich Hesselmann 2016-03-22
9263425 Semiconductor device including multiple semiconductor chips and a laminate Petteri Palm, Angela Kessler 2016-02-16