Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9527728 | Integrated circuit package and method | Marie-Solange Anne Milleron, Benjamin Michael Sutton | 2016-12-27 |
| 9524926 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Abram Castro | 2016-12-20 |
| 9496171 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Steven Kummerl, Wei-Yan Shih | 2016-11-15 |