Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9496171 | Printed interconnects for semiconductor packages | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Wei-Yan Shih | 2016-11-15 | $11,505,000 |
| 9378882 | Method of fabricating an electronic circuit | Richard J. Saye | 2016-06-28 | $16,410,000 |
| 9241405 | Interposer with extruded feed-through vias | — | 2016-01-19 | $12,158,000 |