Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318375 | Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias | Douglas C. La Tulipe, Jr. | 2016-04-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318375 | Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias | Douglas C. La Tulipe, Jr. | 2016-04-19 |