Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502395 | Power semiconductor package having vertically stacked driver IC | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-11-22 |
| 9397212 | Power converter package including top-drain configured power FET | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-07-19 |
| 9362221 | Surface mountable power components | Daniel Cutler, Scott Palmer, Clive O'Dell, Rupert Burbidge | 2016-06-07 |
| 9299690 | Method for fabricating a power semiconductor package including vertically stacked driver IC | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-03-29 |
| 9269655 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Andrew N. Sawle, Daniel Cutler | 2016-02-23 |