Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502395 | Power semiconductor package having vertically stacked driver IC | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-11-22 |
| 9461022 | Power semiconductor package with a common conductive clip | Eung San Cho, Chuan Cheah | 2016-10-04 |
| 9397212 | Power converter package including top-drain configured power FET | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-07-19 |
| 9349677 | Stacked half-bridge package with a common leadframe | Eung San Cho, Chuan Cheah | 2016-05-24 |
| 9299690 | Method for fabricating a power semiconductor package including vertically stacked driver IC | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-03-29 |
| 9269655 | Method for fabricating a semiconductor package with conductive carrier integrated heat spreader | Eung San Cho, Mark Pavier, Daniel Cutler | 2016-02-23 |