KU

Kunihiko Ueno

HO Hoya: 1 patents #36 of 128Top 30%
Overall (2016): #321,624 of 481,213Top 70%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9245814 Substrate assembly, method of manufacturing substrate assembly and method of manufacturing chip package Takashi Fushie, Hajime Kikuchi 2016-01-26