Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9245814 | Substrate assembly, method of manufacturing substrate assembly and method of manufacturing chip package | Kunihiko Ueno, Hajime Kikuchi | 2016-01-26 |
| 9232652 | Manufacturing method of substrate, manufacturing method of wiring substrate, glass substrate and wiring substrate | Hajime Kikuchi | 2016-01-05 |