Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437516 | Chip-embedded packages with backside die connection | Ralf Otremba, Josef Höglauer, Manfred Schindler, Thorsten Scharf | 2016-09-06 |
| 9331060 | Device including two power semiconductor chips and manufacturing thereof | Ralf Otremba, Josef Hoeglauer, Joachim Mahler | 2016-05-03 |