| 9425156 |
Semiconductor packages having semiconductor chips disposed in opening in shielding core plate |
Yoonha Jung, Bona Baek, Heeseok Lee, Kyoungsei Choi |
2016-08-23 |
| 9370098 |
Package substrates and integrated circuit packages including the same |
Byoung Wook Jang, Su-Min Park |
2016-06-14 |
| 9355931 |
Package-on-package devices and methods of manufacturing the same |
Jangwoo Lee, Kyoungsei Choi, Sayoon Kang, Donghan Kim, Hwanggil Shim |
2016-05-31 |
| 9252031 |
Semiconductor package and method of fabricating the same |
Hohyeuk Im, Gowoon Seong, Seokwon Lee, Byoungwook Jang, Eunseok Cho |
2016-02-02 |
| 9252095 |
Semiconductor package and method of fabricating the same |
Su-Min Park, Soojeoung Park, Bona Baek, Hohyeuk Im, Byoungwook Jang +1 more |
2016-02-02 |
