Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425156 | Semiconductor packages having semiconductor chips disposed in opening in shielding core plate | Yoonha Jung, Jongkook Kim, Bona Baek, Heeseok Lee | 2016-08-23 |
| 9355931 | Package-on-package devices and methods of manufacturing the same | Jongkook Kim, Jangwoo Lee, Sayoon Kang, Donghan Kim, Hwanggil Shim | 2016-05-31 |