Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9511438 | Solder bump forming method and apparatus | Issaku Sato, Akira Takaguchi, Takashi Nauchi | 2016-12-06 |
| 9419279 | Vanadium battery | Tomoo Yamamura, Xiongwei WU, Hiroki Sakuraba, Kenji Shirasaki, Suguru Ohta | 2016-08-16 |
| 9278409 | Core ball, solder paste, formed-solder, flux-coated core ball and solder joint | Hiroyoshi Kawasaki, Shigeki Kondo, Atsushi Ikeda, Takahiro Roppongi, Daisuke Soma | 2016-03-08 |
| 9266196 | Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste | Takashi Akagawa, Hiroyoshi Kawasaki, Kazuhiko Matsui, Yuichi Koikeda, Masaru Sasaki +3 more | 2016-02-23 |