AT

Akira Takaguchi

SC Senju Metal Industry Co.: 1 patents #9 of 45Top 20%
📍 Toyama, JP: #111 of 274 inventorsTop 45%
Overall (2016): #475,668 of 481,213Top 100%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9511438 Solder bump forming method and apparatus Issaku Sato, Isamu Sato, Takashi Nauchi 2016-12-06