Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508676 | Semiconductor package structure having hollow chamber and bottom substrate and package process thereof | Cheng-Hung Shih, Yung-Wei Hsieh, Shu-Chen Lin, Yen-Ting Chen | 2016-11-29 |