| 9530458 |
Stub minimization using duplicate sets of signal terminals |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-12-27 |
| 9515053 |
Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-12-06 |
| 9496243 |
Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-11-15 |
| 9437579 |
Multiple die face-down stacking for two or more die |
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed |
2016-09-06 |
| 9423824 |
Stub minimization for multi-die wirebond assemblies with parallel windows |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-08-23 |
| 9377824 |
Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-06-28 |
| 9373565 |
Stub minimization for assemblies without wirebonds to package substrate |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-06-21 |
| 9287195 |
Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-03-15 |
| 9281271 |
Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate |
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba |
2016-03-08 |