Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362248 | Coreless package structure and method for manufacturing same | Yong Ha Woo, Wen-Lun Lo | 2016-06-07 |
| 9357647 | Packaging substrate, method for manufacturing same, and chip packaging body having same | Chu-Chin Hu, Shih-Ping Hsu, Chih-Jen Hsiao | 2016-05-31 |