Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484224 | Method of fabricating a circuit board structure | — | 2016-11-01 |
| 9370105 | Package apparatus with multiple pillar layers | Che-Wei Hsu | 2016-06-14 |
| 9357647 | Packaging substrate, method for manufacturing same, and chip packaging body having same | Chu-Chin Hu, E-Tung Chou, Chih-Jen Hsiao | 2016-05-31 |
| 9338900 | Interposer substrate and method of fabricating the same | Pao-Hung Chou, Che-Wei Hsu | 2016-05-10 |
| 9271388 | Interposer and package on package structure | — | 2016-02-23 |
| 9265146 | Method for manufacturing a multi-layer circuit board | Che-Wei Hsu | 2016-02-16 |
| 9232665 | Method of fabricating packaging substrate having a passive element embedded therein | Zhao-Chong Zeng | 2016-01-05 |