Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281274 | Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof | Xing Zhao, Chang Bum Yong, Kyaw Oo Aung, Ling Ji | 2016-03-08 |
| 9257382 | Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer | Lai Yee Chia, Chang Beom Yong | 2016-02-09 |