Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281274 | Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof | Xing Zhao, Chang Bum Yong, Duk Ju Na, Kyaw Oo Aung | 2016-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281274 | Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof | Xing Zhao, Chang Bum Yong, Duk Ju Na, Kyaw Oo Aung | 2016-03-08 |