Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466568 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Ling Yang, Ying Ji | 2016-10-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466568 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Ling Yang, Ying Ji | 2016-10-11 |