CS

Cheng-Hung Shih

CT Chipbond Technology: 2 patents #1 of 14Top 8%
NU National Sun Yat-Sen University: 1 patents #16 of 59Top 30%
Overall (2016): #77,161 of 481,213Top 20%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9508676 Semiconductor package structure having hollow chamber and bottom substrate and package process thereof Yung-Wei Hsieh, Shu-Chen Lin, Fu-Yen Ho, Yen-Ting Chen 2016-11-29
9312440 Epitaxy structure of a light emitting element having III-nitride quantum wells I-Kai Lo, Yu-Chi Hsu, Wen-Yuan Pang 2016-04-12
9230823 Method of photoresist strip Kuo-Hua Yang, Hsiang-Pin Hou 2016-01-05