Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9513254 | Microfluidic sensor package structure and method | Hyung-II Jeon, Ji Young Chung, Chan Ha Hwang, Yung Woo Lee, Do Hyun Na +1 more | 2016-12-06 |
| 9508631 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2016-11-29 |
| 9431334 | Semiconductor device having single layer substrate and method | Hyung Il Jeon, Gi Jeong Kim, Jae Min Bae, Tae Ki Kim | 2016-08-30 |
| 9412729 | Semiconductor package and fabricating method thereof | Ji Young Chung, Choon Heung Lee, Glenn Rinne | 2016-08-09 |
| 9293398 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2016-03-22 |
| 9275939 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2016-03-01 |