Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9513254 | Microfluidic sensor package structure and method | Hyung-II Jeon, Chan Ha Hwang, Byong Jin Kim, Yung Woo Lee, Do Hyun Na +1 more | 2016-12-06 |
| 9418942 | Semiconductor device | Yoon Joo Kim, Do Hyun Na | 2016-08-16 |
| 9412729 | Semiconductor package and fabricating method thereof | Choon Heung Lee, Glenn Rinne, Byong Jin Kim | 2016-08-09 |
| 9293398 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2016-03-22 |