Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349613 | Electronic package with embedded materials in a molded structure to control warpage and stress | Bora Baloglu | 2016-05-24 |
| 9269872 | Molded electronic package geometry to control warpage and die stress | Bora Baloglu | 2016-02-23 |