Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9349613 | Electronic package with embedded materials in a molded structure to control warpage and stress | Bora Baloglu | 2016-05-24 | $5,703,000 |
| 9269872 | Molded electronic package geometry to control warpage and die stress | Bora Baloglu | 2016-02-23 | $14,299,000 |