Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487392 | Method of packaging integrated circuits and a molded package | Dominic Maier, Thomas Kilger | 2016-11-08 |
| 9275878 | Metal redistribution layer for molded substrates | Dominic Maier, Thomas Kilger | 2016-03-01 |