Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487392 | Method of packaging integrated circuits and a molded package | Ulrich Wachter, Thomas Kilger | 2016-11-08 |
| 9368435 | Electronic component | Ralf Otremba, Klaus Schiess, Chooi Mei Chong | 2016-06-14 |
| 9275878 | Metal redistribution layer for molded substrates | Ulrich Wachter, Thomas Kilger | 2016-03-01 |