TL

Thiam Huat Lim

Infineon Technologies Ag: 1 patents #329 of 832Top 40%
📍 Melaka City, MY: #10 of 34 inventorsTop 30%
Overall (2016): #205,261 of 481,213Top 45%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9373609 Bump package and methods of formation thereof Meng Tong Ong, Kok Chai Goh 2016-06-21