Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490193 | Electronic device with multi-layer contact | Alexander Heinrich, Michael Juerss, Konrad Roesl, Oliver Eichinger, Tobias Schmidt | 2016-11-08 |
| 9373609 | Bump package and methods of formation thereof | Meng Tong Ong, Thiam Huat Lim | 2016-06-21 |
| 9275944 | Semiconductor package with multi-level die block | — | 2016-03-01 |