Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385059 | Overmolded substrate-chip arrangement with heat sink | Juergen Schaefer, Liu Chen, Markus Dinkel, Stefan Macheiner | 2016-07-05 |
| 9362187 | Chip package having terminal pads of different form factors | — | 2016-06-07 |
| 9299673 | Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith | Matthias von Daak, Dirk Hesidenz | 2016-03-29 |