Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385059 | Overmolded substrate-chip arrangement with heat sink | Peter Ossimitz, Juergen Schaefer, Markus Dinkel, Stefan Macheiner | 2016-07-05 |
LC
Liu Chen
Overall (2016): #316,269 of 481,213Top 70%
1
Patents 2016