Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368475 | Semiconductor device and manufacturing method thereof | Shang-Chun Chen, Cha-Hsin Lin | 2016-06-14 |
| 9257322 | Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance | Erh-Hao Chen, Cha-Hsin Lin | 2016-02-09 |
| 9257338 | TSV substrate structure and the stacked assembly thereof | Chung-Chih Wang, Pei-Jer Tzeng, Cha-Hsin Lin | 2016-02-09 |