Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257322 | Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance | Cha-Hsin Lin, Tzu-Kun Ku | 2016-02-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257322 | Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance | Cha-Hsin Lin, Tzu-Kun Ku | 2016-02-09 |