Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9239359 | Test access architecture for TSV-based 3D stacked ICS | Erik Jan Marinissen, Mario Konijnenburg, Chun-Chuan Chi | 2016-01-19 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9239359 | Test access architecture for TSV-based 3D stacked ICS | Erik Jan Marinissen, Mario Konijnenburg, Chun-Chuan Chi | 2016-01-19 |