Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9239359 | Test access architecture for TSV-based 3D stacked ICS | Jacobus Verbree, Mario Konijnenburg, Chun-Chuan Chi | 2016-01-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9239359 | Test access architecture for TSV-based 3D stacked ICS | Jacobus Verbree, Mario Konijnenburg, Chun-Chuan Chi | 2016-01-19 |