Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461109 | Method of forming superjunction high voltage devices using wafer bonding | Samuel J. Anderson | 2016-10-04 |
| 9349725 | Stripe orientation for trenches and contact windows | Kenji Sugiura | 2016-05-24 |
| 9318554 | Gate pad and gate feed breakdown voltage enhancement | Kenji Sugiura | 2016-04-19 |