Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461109 | Method of forming superjunction high voltage devices using wafer bonding | Takeshi Ishiguro | 2016-10-04 |
| 9299774 | Device structure and methods of forming superjunction lateral power MOSFET with surrounding LDD | Patrick M. Shea, David N. Okada | 2016-03-29 |