Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337173 | Three-dimensional inter-chip contact through vertical displacement MEMS | Kenneth J. Goodnow, Stephen G. Shuma, Peter A. Twombly | 2016-05-10 |
| 9230940 | Three-dimensional chip stack for self-powered integrated circuit | Kenneth J. Goodnow, Stephen G. Shuma, Peter A. Twombly | 2016-01-05 |