| 9337173 |
Three-dimensional inter-chip contact through vertical displacement MEMS |
Todd E. Leonard, Stephen G. Shuma, Peter A. Twombly |
2016-05-10 |
| 9301424 |
Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit |
Kerry Bernstein, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff |
2016-03-29 |
| 9264150 |
Reactive metal optical security device and methods of fabrication and use |
Kerry Bernstein, Clarence R. Ogilvie, Charles S. Woodruff, Sebastian T. Ventrone |
2016-02-16 |
| 9257366 |
Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit |
Kerry Bernstein, Clarence R. Ogilvie, John Sargis, Jr., Sebastian T. Ventrone, Charles S. Woodruff |
2016-02-09 |
| 9230940 |
Three-dimensional chip stack for self-powered integrated circuit |
Todd E. Leonard, Stephen G. Shuma, Peter A. Twombly |
2016-01-05 |
